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Revised october 2003the cd4015bseries types are supplied in16leadhermeticdualinlineceramicpackages f3a suffix, 16lead dualinlineplasticpackage datasheet search, datasheets, datasheet search site for electronic components and semiconductors, integrated circuits, diodes and other semiconductors. Amba network interconnect nic301 technical reference. Parameter min typ max unit test conditionscomments. Rfd900 radio modem data sheet rfd900 product specifications and performance rfd900 configuration rfd900 modem tools user manual rfdesign pty ltd 697 jijaws street sumner park, qld 4074. Chipfet package exhibits excellent thermal capabilities. To give simultaneous internet access to many devices, plug in any router you like. Data sheet acquired from harris semiconductorschs025d.
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This device contains two independent gates each of which performs the logic nand function order number dm7420n package number n14a package description 14lead plastic dualinline package pdip, jedec ms001, 0. October 2001 product description dp410 epoxy adhesive is a low flow, twopart epoxy based structural adhesive. Ideal device for applications where board space is at a premium. Amba network interconnect nic301 technical reference manual.
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